PCB Designing on Professional Software

Price:
₹ 10,000Take this course

Course Features

  • Course Duration: 2 weeks(6 hour per day)/4 weeks(3 hour per day)/ 60 Hours
  • Category:
  • Students: 0
  • Certificate: Yes
  • Location: Janakpuri East New Delhi
  • Language: Altium/Proteus/OrCad
  • Lesson: 0
  • Viewers: 14042
  • Prerequisites: No
  • Skill Level: Beginner
  • Course Capacity: 20
  • Start Course: 05/20/2019

Descriptions

PCB (Printed Circuit Board) designing is an integral part of each Electronics products and should known to each electronics engineering students and who are working in electronics industry.

This program is designed to make student and  professionals capable to design PCB up to Industrial grade.

 

Pre-requisites

Knowledge of Electronics Components.

Benefits

  • Certification from Embedded Technology Foundation, New Delhi.
  • Hands-on experience of working with PCB Design.
  • Exposure to complete PCB Design & manufacturing process.
  • Experience of Best learning practice
  • Knowledge of Electronic Components
  • Understanding of Electronics Project Design Flow.

Features

  • Knowledge of Electronic components
  • Understanding of Electronics Project Design Flow
  • Knowledge of Schematic Design techniques
  • Knowledge of PCB Design techniques
  • Personal Experience of working with PCB
 
Curriculum
Section 1 : Introduction to PCB designing concepts
a. Introduction and brief history
  I. What is PCB    
  II. Difference between PWB and PCB    
  III. Types of PCBs    
  IV. Single Sided (Single Layer)    
  V. Multi-Layer (Double Layer)    
  VI. PCB Materials    
b. Trends in PCB designing
  I. Older PCB Method    
  II. PCB Designing Using Graph Paper    
  III. Making a hand drawn PCB    
  IV. Using Computer for EDA    
c. Introduction to electronic design automation(EAD)
  I. Brief History of EDA    
  II. Latest Trends in Market    
  III. How it helps and Why it requires    
  IV. Different EDA tools    
  V. Introduction to SPICE and PSPICE Environment    
  VI. Introduction and Woriking of PROTEUS    
Section 2 : Component introduction and their categories
a. Types of components
  I. Active Components    
  II. Diode    
  III. Transistor    
  IV. MOSFET    
  V. LED    
b. Component package types
  I. Through Hole Packages    
  II. Axial lead    
  III. Radial Lead    
  IV. Single Inline Package(SIP)    
  V. Dual Inline Package(DIP)    
  VI. Transistor Outline(TO)    
  VII. Pin Grid Array(PGA)    
  VIII. Through Hole Packages    
  IX. Metal Electrode Face(MELF)    
  X Leadless Chip Carrier(LCC)    
  XI. Small Outline Integrated Circuit(SOIC)    
  XII. Quad Flat Pack(QPF) and Thin QFP (TQFP)    
  XIII. Ball Grid Array(BGA)    
  XIV. Plastic Leaded Chip Carrier(PLCC)    
  XV. Inductor    
  XVI. Transformer    
  XV. Speaker/Buzzer    
Section 3 : Introduction to development tools
a. Introduction of PROTUEUS ISIS software for schematic entry
  I. Brief Introduction of various simulators    
  II. Description to Proteus ISIS simulator tool    
  III. Hands on practice on available library of components    
  IV. Working through wiring and schematic designing    
  V. Making New Component Symbols    
b. Introduction of PROTUEUS ARES software for PCB designing
  I. Connecting the schematic From ISIS to ARES for Netlising    
  II. Selecting the Components Footprints as per design    
  III. Picking and placing the Component    
  IV. Making New Footprints    
  V. Assigning Footprint to components    
Section 4 : Detailed description and practicals of PCB designing
a. PCB Designing Flowchart
  I. Schematic Entry    
  II. Netlisting    
  III. PCB Layout Designing    
  IV. Prototype Designing    
  V. Design Rule Check(DRC)    
  VI. Design For Manufacturing(DFM)    
  VII. PCB Making    
  VIII. Printing    
  IX. Etching    
  X. Drilling    
  XI. Assembly of components    
b. Description of PCB Layers
  I. Electrical Layers    
  II. Top Layer    
  III. Mid Layer    
  IV. Bottom Layer    
  V. Mechanical Layers    
  VI. Board Outlines and Cutouts    
  VII. Drill Details    
  VIII. Documentation Layers    
  IX. Components Outlines    
  X. Reference Designation    
  XI. Text    
c. Keywords & their description
  I. Footprint    
  II. Pad stacks    
  III. Vias    
  IV. Tracks    
  V. Color of Layers    
  VI. PCB Track Size Calculation Formula    
d. PCB materials
  I. Standard FR-4 Epoxy Glass    
  II. Multifuctional FR-4    
  III. Tetra Functional FR-4    
  IV. NelcoN400-6    
  V. GETEK    
  VI. BT Epoxy Glass    
  VII. Cyanate Aster    
  VIII. Plyimide Glass    
  IX. Teflon    
e. Rules for track
  I. Track Length    
  II. Track Angle    
  III. Track Joints    
  IV. Track Size    
f. Study of IPC Standards
  I. IPC Standard For Schematic Design    
  II. IPC Standard For PCB Designing    
  III. IPC Standard For PCB Meterials    
  IV. IPC Standard For Documentation and PCB Fabrication    
Section 5 : Lab practice and designing concepts
a. Starting the PCB designing
  I. Understanding the schematic Entry    
  II. Creating Library & Components    
  III. Drawing a Schematic    
  IV. Flat Design / hierarchical Design    
  V. Setting up Environment for PCB    
  VI. Design a Board    
b. Autorouting
  I. Introduction to Autorouting    
  II. Setting up Rules    
  III. Defining Contraints    
  IV. Autorouter Setup    
c. PCB design practice
  I. PCB Designing of Basic and Analog Electronic Circuits    
  II. PCB Designing of Power Supplies    
  III. PCB Designing of Different Sensor modules    
  IV. PCB Designing of Electronics Projects    
  V. PCB Designing of Embedded Projects    
d. Post designing & PCB fabrication process
  I. Printing the Design    
  II. Eaching    
  III. Drilling    
  IV.
Interconnecting and Packaging electronic Circuits (IPC) Standards
    
  V. Gerber Generation    
  VI. Soldering and Desoldering    
  VII. Component Mounting    
  VIII. PCB and Hardware Testing    
e. Project work
  I. Making the schematic of Acedemic and Industrial projects    
  II. PCB Designing of these projects    
  III. Soldering and Desoldering of componets as per Design    
  IV. Testing and Troubleshoting Methods    
Section 6 : Project work and documentation
a. Project work and documentation
  I. Description of Project Development Process    
  II. Project Discusion & Allotment    
  III. Synopsis Making & Submission    
  IV. Practice of De-Soldering & Soldering    
  V. Introduction to Hardware Techniues    
  VI. Project Completion    
  VII. Detailed Project Report Submission    
  VIII. Final Project PPT    
  IX. Feedback Submission (Written & Video)    
  X. Certification Distribution    

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Our Main Teachers

  • BHIM CHAND BHARDWAJ

    MASTER TRAINER- EMBEDDED SYSTEM DESIGN Mr. Bhim Chand Bhardwaj has over 8+ years of experience in various aspects of Students and Working Professional Training, Embedded Product Design, Electronics Manufacturing Services. Apart from this, he has worked as a Senior Product Manager at EMTECH Foundation since 2011. He has gain incredulous experience in past 8 years …
    Continue reading BHIM CHAND BHARDWAJ